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Cooler Master PTK-L01 CPU Thermal Compound 4G

8.000 JOD
8.000 JOD
Sale Sold out
  • Nano-level high-performance thermal conductive material, more effective heat dissipation.
  • Needle-type sealing filling process, more reliable quality,
  • Specially designed CPU module paper, more accurate application, no waste.
  • Comes with a thermal paste scraper, for more even coating.
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    Product Product subtotal Quantity Price Product subtotal
    Cooler Master PTK-L01 CPU Thermal Compound 4G
    Cooler Master PTK-L01 CPU Thermal Compound 4G
    8.000 JD/ea    		 0.000 JD
    Sold out
    		8.000 JD/ea 0.000 JD
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